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Alumina (Al2O3) ceramics are currently the most widely used ceramic substrate materials for packaging. They possess excellent properties such as high...
DPC (Direct Plated Copper) involves physical vapor deposition (PVD) method-Sputtering under high temperature and pressure conditions to plate the...
Aluminum Nitride Ceramic PCB Aluminum Nitride (AlN) is currently the best ceramic substrate material accessible. Its properties of high thermal...
